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- W2104112848 abstract "Electromigration lifetime tests on single-level Al-Cu interconnection with straight and meandering lines and two-level Al-Cu interconnection with W stud chains have been carried out. The electromigration resistance of W stud chains was found to be less than half of that of Al-Cu straight lines. The discontinuity of Cu supply at Al-Cu/W interfaces accounts for most of the reduction in the electromigration resistance of W stud chains. The shorter electromigration lifetime in W stud chains and Al-Cu meandering lines as compared to Al-Cu straight lines reflects the effect of current crowding at studs.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
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- W2104112848 date "2002-12-04" @default.
- W2104112848 modified "2023-09-26" @default.
- W2104112848 title "Electromigration in a two-level Al-Cu interconnection with W studs" @default.
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- W2104112848 doi "https://doi.org/10.1109/vmic.1990.127852" @default.
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