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• W2104718091 abstract "Uniformly interconnected CuNi mesh film was prepared by using a simple transfer printing method. The CuNi mesh films showed excellent heating performances, which reached a maximum steady-state temperature of 225 °C in 60 s, with respect to applied low-voltage (9 V), and better thermal stability than that of the pure Cu mesh film." @default.
• W2104718091 created "2016-06-24" @default.
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• W2104718091 date "2015-01-01" @default.
• W2104718091 modified "2023-10-14" @default.
• W2104718091 title "A cupronickel-based micromesh film for use as a high-performance and low-voltage transparent heater" @default.
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• W2104718091 doi "https://doi.org/10.1039/c5ta03348a" @default.
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