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- W2104738963 abstract "The Letter reports epitaxial liftoff and direct bonding of GaAs/AlxGa1−xAs heterostructure device arrays and continuous films, using a single transparent polymer membrane to support the material during etch of the sacrificial layer and to manipulate it into position for bonding. Au–Sn eutectic alloy bonding leads to a metallurgical bond in minutes. Photoluminescence and current–voltage characteristics show that material quality is not substantially degraded in the transfer process." @default.
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- W2104738963 date "1993-05-27" @default.
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- W2104738963 title "Alignable liftoff transfer of device arrays via a single polymeric carrier membrane" @default.
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- W2104738963 doi "https://doi.org/10.1049/el:19930634" @default.
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