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- W2105297912 abstract "This paper reports on possible interconnect solutions between a Silicon MMIC and an off-chip antenna. These shall both be integrated within a plastic package to achieve a 122 GHz system-in-package. Coplanar wire bond and flip chip interconnects are shortly introduced and compared. Simulation and measurement results of matched interconnects are then evaluated in a frequency range between 110 and 170 GHz. A matched 400 μm long wire bond interconnect as well as a self-matching half-wave wire bond are compared to a flip chip interconnect." @default.
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- W2105297912 date "2011-06-01" @default.
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- W2105297912 title "Design and measurement of matched wire bond and flip chip interconnects for D-band system-in-package applications" @default.
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- W2105297912 doi "https://doi.org/10.1109/mwsym.2011.5972851" @default.
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