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• W2105428293 abstract "Abstract Conductive composites consisted of epoxy resin and polyanilines (PANIs) doped with dodecylbenzenesulfonic acid ( 1 ), dodecylsulfonic acid (2), di(2‐ethylhexyl)sulfosuccinic acid (3), and HCl were synthesized by use of N ‐ tert ‐butyl‐5‐methylisoxazolium perchlorate (5) under various reaction conditions. It was found that the composites with PANI doped with acid 2 (PANI‐2) prepared by curing with 10 mol % of reagent 5 at 80 °C for 12 h showed high electroconductivity along with the low conducting percolation threshold (3 wt % of PANI‐2). Furthermore, the composite with even ˜10 wt % of PANI‐2 exhibited ˜10 − 1 S/cm of electroconductivity. The UV–vis and IR measurements indicated that the conductive emeraldine salt form of PANI‐2 in the composite was maintained after the curing reaction. The thermal stability was studied by TGA and DSC measurements, and then, the T d 10 and T g of the composite with 5 and 10 wt % of PANI‐2 were found to be similar to those with the cured epoxy resin itself. In addition, the similar investigation with an oxetane resin instead of the epoxy resin was also carried out. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 718–726, 2006" @default.
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• W2105428293 date "2005-11-30" @default.
• W2105428293 modified "2023-10-17" @default.
• W2105428293 title "Syntheses of conductive adhesives based on epoxy resin and polyanilines by usingN-tert-butyl-5-methylisoxazolium perchlorate as a thermally latent curing reagent" @default.
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• W2105428293 doi "https://doi.org/10.1002/pola.21085" @default.
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