FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2105526811> ?p ?o ?g. }

• W2105526811 endingPage "G314" @default.
• W2105526811 startingPage "G314" @default.
• W2105526811 abstract "We report on the use of mixed abrasive slurries (MAS) containing alumina and ceria abrasives for chemical mechanical planarization (CMP) of silicon dioxide and silicon nitride films for shallow trench isolation applications, extending an earlier investigation of alumina/silica MAS for the CMP of copper and tantalum films. These slurries show a polish rate selectivity between oxide and nitride films that is as high as 65 and show an excellent surface quality even without additives. Analysis of dried slurry particles using transmission electron microscopy indicates formation of a sheath of smaller ceria particles around larger alumina particles. Possible explanations and supportive arguments for the improved performance of MAS during CMP are presented based on the particle-particle and particle-film interactions. © 2003 The Electrochemical Society. All rights reserved." @default.
• W2105526811 created "2016-06-24" @default.
• W2105526811 creator A5013475838 @default.
• W2105526811 creator A5019614560 @default.
• W2105526811 creator A5020152636 @default.
• W2105526811 date "2003-01-01" @default.
• W2105526811 modified "2023-09-26" @default.
• W2105526811 title "Chemical Mechanical Polishing of Dielectric Films Using Mixed Abrasive Slurries" @default.
• W2105526811 cites W1970033207 @default.
• W2105526811 cites W1972207333 @default.
• W2105526811 cites W1989507916 @default.
• W2105526811 cites W1989646176 @default.
• W2105526811 cites W2003621285 @default.
• W2105526811 cites W2009524254 @default.
• W2105526811 cites W2020770344 @default.
• W2105526811 cites W2027935616 @default.
• W2105526811 cites W2043422764 @default.
• W2105526811 cites W2046264839 @default.
• W2105526811 cites W2086481406 @default.
• W2105526811 cites W2108675825 @default.
• W2105526811 cites W2119076888 @default.
• W2105526811 cites W2138812979 @default.
• W2105526811 cites W2157975130 @default.
• W2105526811 cites W2169065685 @default.
• W2105526811 cites W2169119348 @default.
• W2105526811 cites W2131996702 @default.
• W2105526811 doi "https://doi.org/10.1149/1.1564110" @default.
• W2105526811 hasPublicationYear "2003" @default.
• W2105526811 type Work @default.
• W2105526811 sameAs 2105526811 @default.
• W2105526811 citedByCount "46" @default.
• W2105526811 countsByYear W21055268112012 @default.
• W2105526811 countsByYear W21055268112013 @default.
• W2105526811 countsByYear W21055268112014 @default.
• W2105526811 countsByYear W21055268112015 @default.
• W2105526811 countsByYear W21055268112016 @default.
• W2105526811 countsByYear W21055268112017 @default.
• W2105526811 countsByYear W21055268112021 @default.
• W2105526811 countsByYear W21055268112022 @default.
• W2105526811 countsByYear W21055268112023 @default.
• W2105526811 crossrefType "journal-article" @default.
• W2105526811 hasAuthorship W2105526811A5013475838 @default.
• W2105526811 hasAuthorship W2105526811A5019614560 @default.
• W2105526811 hasAuthorship W2105526811A5020152636 @default.
• W2105526811 hasConcept C105066941 @default.
• W2105526811 hasConcept C111368507 @default.
• W2105526811 hasConcept C127313418 @default.
• W2105526811 hasConcept C127413603 @default.
• W2105526811 hasConcept C133386390 @default.
• W2105526811 hasConcept C138113353 @default.
• W2105526811 hasConcept C155310634 @default.
• W2105526811 hasConcept C159985019 @default.
• W2105526811 hasConcept C180088628 @default.
• W2105526811 hasConcept C191897082 @default.
• W2105526811 hasConcept C192562407 @default.
• W2105526811 hasConcept C194760766 @default.
• W2105526811 hasConcept C2777431650 @default.
• W2105526811 hasConcept C2778112282 @default.
• W2105526811 hasConcept C2778517922 @default.
• W2105526811 hasConcept C2779089622 @default.
• W2105526811 hasConcept C2779227376 @default.
• W2105526811 hasConcept C2779851234 @default.
• W2105526811 hasConcept C2780957350 @default.
• W2105526811 hasConcept C42360764 @default.
• W2105526811 hasConcept C49040817 @default.
• W2105526811 hasConcept C514619126 @default.
• W2105526811 hasConcept C544956773 @default.
• W2105526811 hasConcept C94293008 @default.
• W2105526811 hasConceptScore W2105526811C105066941 @default.
• W2105526811 hasConceptScore W2105526811C111368507 @default.
• W2105526811 hasConceptScore W2105526811C127313418 @default.
• W2105526811 hasConceptScore W2105526811C127413603 @default.
• W2105526811 hasConceptScore W2105526811C133386390 @default.
• W2105526811 hasConceptScore W2105526811C138113353 @default.
• W2105526811 hasConceptScore W2105526811C155310634 @default.
• W2105526811 hasConceptScore W2105526811C159985019 @default.
• W2105526811 hasConceptScore W2105526811C180088628 @default.
• W2105526811 hasConceptScore W2105526811C191897082 @default.
• W2105526811 hasConceptScore W2105526811C192562407 @default.
• W2105526811 hasConceptScore W2105526811C194760766 @default.
• W2105526811 hasConceptScore W2105526811C2777431650 @default.
• W2105526811 hasConceptScore W2105526811C2778112282 @default.
• W2105526811 hasConceptScore W2105526811C2778517922 @default.
• W2105526811 hasConceptScore W2105526811C2779089622 @default.
• W2105526811 hasConceptScore W2105526811C2779227376 @default.
• W2105526811 hasConceptScore W2105526811C2779851234 @default.
• W2105526811 hasConceptScore W2105526811C2780957350 @default.
• W2105526811 hasConceptScore W2105526811C42360764 @default.
• W2105526811 hasConceptScore W2105526811C49040817 @default.
• W2105526811 hasConceptScore W2105526811C514619126 @default.
• W2105526811 hasConceptScore W2105526811C544956773 @default.
• W2105526811 hasConceptScore W2105526811C94293008 @default.
• W2105526811 hasIssue "5" @default.
• W2105526811 hasLocation W21055268111 @default.
• W2105526811 hasOpenAccess W2105526811 @default.
• W2105526811 hasPrimaryLocation W21055268111 @default.
• W2105526811 hasRelatedWork W1965061254 @default.
• W2105526811 hasRelatedWork W1969182676 @default.

• next