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- W2105643766 abstract "In this paper, microwave material properties such as dielectric constant and loss tangent of polyimide dielectric as interconnection for multi-chip-module (MCM) or system-in-package (SIP) are investigated. Instead of using conventional parallel-plate capacitance measurement, a transmission line method is used to characterize the microwave material properties of polyimide dielectric up to 50 GHz. The dielectric constant and loss tangent of polyimide dielectric are averagely 2.5 and 0.06 from 5 to 50 GHz, respectively. The microwave evolution in this work shows the polyimide dielectric has high potential to be a microwave interconnection for high-speed and high-frequency circuits in MCM and SIP. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 48: 1675–1678, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21707" @default.
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- W2105643766 date "2006-01-01" @default.
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- W2105643766 title "Evaluation of microwave material of low K interconnection for RF package" @default.
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- W2105643766 doi "https://doi.org/10.1002/mop.21707" @default.
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