Matches in SemOpenAlex for { <https://semopenalex.org/work/W2106778083> ?p ?o ?g. }
Showing items 1 to 94 of
94
with 100 items per page.
- W2106778083 endingPage "752" @default.
- W2106778083 startingPage "745" @default.
- W2106778083 abstract "Heat dissipation is one of the most serious challenges in 3-D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias. In this paper, we extended the TTS-via planning in a multilevel routing framework by Cong and Zhang (2005), but use a much enhanced TTS-via planning algorithm. We formulate the TTS-via minimization problem with temperature constraints as a constrained nonlinear programming problem (NLP) based on the thermal resistive model and develop an efficient heuristic algorithm, named m-ADVP, which solves a sequence of simplified via planning subproblems in alternating direction in a multilevel framework. The vertical via distribution is formulated as a convex programming problem, and the horizontal via planning is based on two efficient techniques: path counting and heat propagation. Experimental results show that the m-ADVP algorithm is more than 200/spl times/ faster than the direct solution to the NPL formulation for via planning with very similar solution quality (within 1% of TS-vias count). However, compared to a recent work of multilevel TS-via planning algorithm based on temperature profiling (Cong and Zhang, 2005), our algorithm can reduce the total TS-via number by over 68% for the same required temperature with similar runtime." @default.
- W2106778083 created "2016-06-24" @default.
- W2106778083 creator A5078536348 @default.
- W2106778083 creator A5086664284 @default.
- W2106778083 date "2005-05-31" @default.
- W2106778083 modified "2023-10-13" @default.
- W2106778083 title "Thermal via planning for 3-D ICs" @default.
- W2106778083 cites W1541633348 @default.
- W2106778083 cites W1966078817 @default.
- W2106778083 cites W1968560449 @default.
- W2106778083 cites W1990333732 @default.
- W2106778083 cites W1993700253 @default.
- W2106778083 cites W2027807023 @default.
- W2106778083 cites W2110090002 @default.
- W2106778083 cites W2129021906 @default.
- W2106778083 cites W2144149750 @default.
- W2106778083 cites W2151734895 @default.
- W2106778083 cites W2153069345 @default.
- W2106778083 cites W2157558963 @default.
- W2106778083 cites W2158969233 @default.
- W2106778083 cites W2162840580 @default.
- W2106778083 cites W2536066754 @default.
- W2106778083 cites W2540437384 @default.
- W2106778083 cites W2900331443 @default.
- W2106778083 doi "https://doi.org/10.5555/1129601.1129707" @default.
- W2106778083 hasPublicationYear "2005" @default.
- W2106778083 type Work @default.
- W2106778083 sameAs 2106778083 @default.
- W2106778083 citedByCount "63" @default.
- W2106778083 countsByYear W21067780832012 @default.
- W2106778083 countsByYear W21067780832013 @default.
- W2106778083 countsByYear W21067780832014 @default.
- W2106778083 countsByYear W21067780832015 @default.
- W2106778083 countsByYear W21067780832016 @default.
- W2106778083 countsByYear W21067780832017 @default.
- W2106778083 countsByYear W21067780832018 @default.
- W2106778083 countsByYear W21067780832019 @default.
- W2106778083 countsByYear W21067780832021 @default.
- W2106778083 crossrefType "proceedings-article" @default.
- W2106778083 hasAuthorship W2106778083A5078536348 @default.
- W2106778083 hasAuthorship W2106778083A5086664284 @default.
- W2106778083 hasConcept C11413529 @default.
- W2106778083 hasConcept C115527620 @default.
- W2106778083 hasConcept C121332964 @default.
- W2106778083 hasConcept C126255220 @default.
- W2106778083 hasConcept C147764199 @default.
- W2106778083 hasConcept C158622935 @default.
- W2106778083 hasConcept C173801870 @default.
- W2106778083 hasConcept C31258907 @default.
- W2106778083 hasConcept C33923547 @default.
- W2106778083 hasConcept C41008148 @default.
- W2106778083 hasConcept C62520636 @default.
- W2106778083 hasConcept C74172769 @default.
- W2106778083 hasConceptScore W2106778083C11413529 @default.
- W2106778083 hasConceptScore W2106778083C115527620 @default.
- W2106778083 hasConceptScore W2106778083C121332964 @default.
- W2106778083 hasConceptScore W2106778083C126255220 @default.
- W2106778083 hasConceptScore W2106778083C147764199 @default.
- W2106778083 hasConceptScore W2106778083C158622935 @default.
- W2106778083 hasConceptScore W2106778083C173801870 @default.
- W2106778083 hasConceptScore W2106778083C31258907 @default.
- W2106778083 hasConceptScore W2106778083C33923547 @default.
- W2106778083 hasConceptScore W2106778083C41008148 @default.
- W2106778083 hasConceptScore W2106778083C62520636 @default.
- W2106778083 hasConceptScore W2106778083C74172769 @default.
- W2106778083 hasLocation W21067780831 @default.
- W2106778083 hasOpenAccess W2106778083 @default.
- W2106778083 hasPrimaryLocation W21067780831 @default.
- W2106778083 hasRelatedWork W1541633348 @default.
- W2106778083 hasRelatedWork W1666750238 @default.
- W2106778083 hasRelatedWork W1993700253 @default.
- W2106778083 hasRelatedWork W2002041333 @default.
- W2106778083 hasRelatedWork W2010084010 @default.
- W2106778083 hasRelatedWork W2023264348 @default.
- W2106778083 hasRelatedWork W2046574526 @default.
- W2106778083 hasRelatedWork W2064922498 @default.
- W2106778083 hasRelatedWork W2115946118 @default.
- W2106778083 hasRelatedWork W2129960401 @default.
- W2106778083 hasRelatedWork W2130517400 @default.
- W2106778083 hasRelatedWork W2137893918 @default.
- W2106778083 hasRelatedWork W2143807959 @default.
- W2106778083 hasRelatedWork W2144149750 @default.
- W2106778083 hasRelatedWork W2151734895 @default.
- W2106778083 hasRelatedWork W2152165066 @default.
- W2106778083 hasRelatedWork W2157558963 @default.
- W2106778083 hasRelatedWork W2162803032 @default.
- W2106778083 hasRelatedWork W2536066754 @default.
- W2106778083 hasRelatedWork W2540437384 @default.
- W2106778083 isParatext "false" @default.
- W2106778083 isRetracted "false" @default.
- W2106778083 magId "2106778083" @default.
- W2106778083 workType "article" @default.