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- W2106908986 abstract "This paper presents a hybrid four-stage distributed amplifier using thin film multi-chip module deposited(MCM-D) based on selectively anodized aluminium substrate with fully embedded passives. Four bare GaAs heterojunction field effect transistors are attached on the all passive-integrated aluminium substrate and interconnected to other devices by wire-bonding. The hybrid distributed amplifier had a unity gain maximum cut-off frequency of 15 GHz, a maximum gain of 8.9 dB over 0.6 GHz to 14.2 GHz band, and a maximum gain flatness of 7.4plusmn1.5 dB over 0.6 GHz to 14.2 GHz bandwidth. The total size is 2.8 mm times 5.5 mm including the bias circuitries and bonding pads." @default.
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- W2106908986 date "2007-10-01" @default.
- W2106908986 modified "2023-10-18" @default.
- W2106908986 title "Hybrid distributed amplifier using MCM-D based on selectively anodized aluminium substrate" @default.
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- W2106908986 doi "https://doi.org/10.1109/eurad.2007.4405006" @default.
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