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- W2106942472 abstract "In this paper we present results on the synthesis of a hybrid organic/inorganic resist based on polyhedral oligomeric silsesquioxane cages and used it in a thermal nanoimprint lithography process. Our resist has been developed in order to be uniformly spin coated on silicon substrates, imprinted at a reduced temperature (40^oC), then cross-linked first at elevated temperatures (>120^oC) during the imprinting process and then by exposure to UV radiation outside the imprinting tool. With this process, a low shrinkage rate of the resist is achieved after cross-linking, combined with high mechanical and thermal properties." @default.
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- W2106942472 date "2010-09-19" @default.
- W2106942472 modified "2023-10-13" @default.
- W2106942472 title "Low temperature direct imprint of polyhedral oligomeric silsesquioxane (POSS) resist" @default.
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