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- W2107857943 abstract "As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 µm and diameter of 10 µm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10−5 [Ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling." @default.
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- W2107857943 date "2015-08-01" @default.
- W2107857943 modified "2023-09-24" @default.
- W2107857943 title "High-speed via hole filling using electrophoresis of Ag nanoparticles" @default.
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- W2107857943 doi "https://doi.org/10.1109/3dic.2015.7334570" @default.
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