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- W2107933348 abstract "This paper describes a tool that can be used in the thermal management design of electronic printed circuit assemblies at both the board level and the system level. The thermal load board tool simulates actual thermal conditions that can be easily modeled and validated. The approach described herein is useful in minimizing electronic system development time and cost." @default.
- W2107933348 created "2016-06-24" @default.
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- W2107933348 date "2009-01-01" @default.
- W2107933348 modified "2023-09-26" @default.
- W2107933348 title "Thermal load boards — another thermal management design tool" @default.
- W2107933348 cites W2150328878 @default.
- W2107933348 doi "https://doi.org/10.1109/stherm.2009.4810744" @default.
- W2107933348 hasPublicationYear "2009" @default.
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