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- W2108214456 abstract "Thermomechanical simulation of solder joints of J-leaded components has permitted optimizations of the mounting process and provided confidence and time-saving before running qualification tests. The difficulties and the cost of performing solder joint inspection have led to their replacement by novel quality insurance procedures. The first experimental results are promising. >" @default.
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- W2108214456 date "2003-01-06" @default.
- W2108214456 modified "2023-09-27" @default.
- W2108214456 title "Solder joints reliability of surface mounted components: a requirement for new quality insurance procedures" @default.
- W2108214456 cites W2101602749 @default.
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- W2108214456 doi "https://doi.org/10.1109/eemts.1988.75971" @default.
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