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• W2108523754 abstract "The integration and packaging of optoelectronic devices with electronic circuits and systems has growing application in many fields, ranging from long to micro haul links. An exploration of the opportunities, integration technologies, and some recent results using thin-film device heterogeneous integration with Si CMOS VLSI and GaAs MESFET circuit technologies are presented. Applications explored include alignment tolerant optoelectronic links for network interconnections, smart pixel focal plane array processing through the integration of imaging arrays with sigma delta analog to digital converters underneath each pixel, and three-dimensional computational systems using vertical through-Si optical interconnections." @default.
• W2108523754 created "2016-06-24" @default.
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• W2108523754 date "2000-11-01" @default.
• W2108523754 modified "2023-09-27" @default.
• W2108523754 title "Microsystem optoelectronic integration for mixed multisignal systems" @default.
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• W2108523754 doi "https://doi.org/10.1109/2944.902172" @default.
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