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- W2108527717 abstract "An investigation of the effect of Shallow trench isolation (STI) technology on DC characteristic is presented. STI parameter of SA/SB impact on device characteristic is mainly considered, and discovered the small width device has different variation trench. Through comparing Agilent ICCAP simulation data with experimental data wafers fabricated using SMIC 0.13μm technology find that BSIM4 STI model is very well to fit all size devices except small width device. We design eight active lengths (i.e. SA=0.4μm, 0.8μm, 1.2μm, 1.6μm, 2.0μm, 2.4μm, 2.8μm and 3.2μm, and SA=SB) both PMOS and NMOS. Dependence of threshold voltage (V th ) on SA/SB is shown." @default.
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- W2108527717 date "2011-12-01" @default.
- W2108527717 modified "2023-09-25" @default.
- W2108527717 title "A study of the effect of shallow trench isolation technology on MOSFET DC characteristic" @default.
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- W2108527717 doi "https://doi.org/10.1109/isicir.2011.6132011" @default.
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