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- W2109050008 abstract "The effect of oxidation on adhesion between a mold compound and copper leadframe material was investigated for OCN and DCP molding compounds and one copper alloy. The oxidation temperatures selected were 175 and 200/spl deg/C and the bake times were varied between 5 minutes and 118 hours. Adhesion strength results obtained by the button shear test method indicated that the DCP mold compound-Cu adhesion was virtually unaffected by oxidation of the Cu at both 175 and 200/spl deg/C for exposure times up to 50 minutes. The adhesion in the case of the OCN mold compound was lower and exhibited a sharp decrease with increasing bake time at both temperatures. The degradation in adhesion strength was attributed primarily to the low cohesive strength of the copper oxide layer." @default.
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- W2109050008 date "2003-01-20" @default.
- W2109050008 modified "2023-09-27" @default.
- W2109050008 title "Effect of oxidation on mold compound-copper leadframe adhesion" @default.
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- W2109050008 doi "https://doi.org/10.1109/isapm.1999.757291" @default.
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