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- W2110126595 abstract "A novel method is proposed to evaluate the chip-level thermal non-uniformity of semiconductor devices by electrical transient thermal response testing. It is found that the degree of integrated chip thermal non-uniformity could be determined non-destructively by the device heating response curves." @default.
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- W2110126595 date "2009-07-01" @default.
- W2110126595 modified "2023-10-05" @default.
- W2110126595 title "Study on the chip-level thermal non-uniformity evaluation of semiconductor devices" @default.
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- W2110126595 doi "https://doi.org/10.1109/ipfa.2009.5232587" @default.
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