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• W2110147750 abstract "Abstract The paper reviews the requirements for carbon nanotubes to be used as interconnects in VLSI integrated circuits. It describes the production by chemical vapour deposition of high density arrays of nanotubes suitable for use as interconnects, and describes their characterisation by Raman and transmission electron microscopy. (© 2008 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)" @default.
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• W2110147750 date "2008-09-24" @default.
• W2110147750 modified "2023-09-30" @default.
• W2110147750 title "Carbon nanotubes for interconnects in VLSI integrated circuits" @default.
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• W2110147750 doi "https://doi.org/10.1002/pssb.200879553" @default.
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