FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W2110506746> ?p ?o ?g. }

• W2110506746 abstract "Regarding the application of the chip on glass (COG) with anisotropic conductive film (ACF) to the liquid crystal displays (LCDs), the problems with the warpage of COG packages, interfacial delamination, and increasing contact resistance of bumps, during or after thermal and moisture loading, are major reliability issues encountered in the industry. The goal in this paper is to investigate the effect of the parameters, such as bonding pressure and temperature during manufacturing, thermal and moisture expansion of the ACF, and its elastic modulus and fillets, associated with thermal cycling (from room temperature to 85 ), on the warpages of the ACF-bonded COG packages. The full-field Twyman-Green interferometry is used for measuring the warpages of the COG packages due to the fabrication with the various bonding pressure and temperature and during thermal cycling. Three-dimensional finite-element models (FEM) are used for calculating the warpage in terms of such parameters, and those results are compared with experimental observations in order to understand the mechanics. The results show that the tremendously saddle-warped shapes are found at the COG packages after manufacturing, and their maximum warpages increase with the bonding pressure but are insensitive to the bonding temperature. However, these large warpages have been obviously relaxed as the temperature goes beyond 50 during the first thermal cycling. After the first cycling, the warpages of the COG packages become much less severe and remain stably, then slightly increase with the temperature. The deformed behaviors of the COG package under the thermal loads have been resolved by comparing the FEM results with the experimental observations. The moisture-induced expansion strain of the saturated ACF in the condition of 29 /85%RH was determined to be 0.147% by means of the combination of experimental and theoretical analyses. It is also found that, for relatively thin fillets, the coefficient of thermal expansion (CTE) and moisture absorption of the ACF do not have any obvious influence on the warpages of the COG packages, but for relatively thick fillets they do somewhat. Moreover, the warpages of the COG package affected by ACF fillet thickness, elastic modulus, and CTE have been thoroughly studied by the finite-element analysis and the results have been interpreted in detail. Overall, for reducing the warpage of the COG package, two approaches are suggested: giving the packages at 85 preheated after manufacturing and precisely controlling low mismatch of CTE between chip and glass substrate, since both play significant roles." @default.
• W2110506746 created "2016-06-24" @default.
• W2110506746 creator A5053469494 @default.
• W2110506746 creator A5055845845 @default.
• W2110506746 creator A5056258868 @default.
• W2110506746 creator A5086856536 @default.
• W2110506746 creator A5091398932 @default.
• W2110506746 date "2007-11-01" @default.
• W2110506746 modified "2023-09-26" @default.
• W2110506746 title "Experimental and Numerical Studies of Warpages of ACF-Bonded COG Packages Induced From Manufacturing and Thermal Cycling" @default.
• W2110506746 cites W2012241126 @default.
• W2110506746 cites W2098986515 @default.
• W2110506746 cites W2113173975 @default.
• W2110506746 cites W2125765328 @default.
• W2110506746 cites W2128785194 @default.
• W2110506746 cites W2143485129 @default.
• W2110506746 cites W2170560481 @default.
• W2110506746 cites W2481445051 @default.
• W2110506746 cites W2535358659 @default.
• W2110506746 doi "https://doi.org/10.1109/tadvp.2007.906393" @default.
• W2110506746 hasPublicationYear "2007" @default.
• W2110506746 type Work @default.
• W2110506746 sameAs 2110506746 @default.
• W2110506746 citedByCount "7" @default.
• W2110506746 countsByYear W21105067462012 @default.
• W2110506746 countsByYear W21105067462016 @default.
• W2110506746 countsByYear W21105067462017 @default.
• W2110506746 crossrefType "journal-article" @default.
• W2110506746 hasAuthorship W2110506746A5053469494 @default.
• W2110506746 hasAuthorship W2110506746A5055845845 @default.
• W2110506746 hasAuthorship W2110506746A5056258868 @default.
• W2110506746 hasAuthorship W2110506746A5086856536 @default.
• W2110506746 hasAuthorship W2110506746A5091398932 @default.
• W2110506746 hasConcept C121332964 @default.
• W2110506746 hasConcept C127413603 @default.
• W2110506746 hasConcept C135628077 @default.
• W2110506746 hasConcept C137693562 @default.
• W2110506746 hasConcept C151730666 @default.
• W2110506746 hasConcept C154945302 @default.
• W2110506746 hasConcept C159985019 @default.
• W2110506746 hasConcept C177564732 @default.
• W2110506746 hasConcept C186260285 @default.
• W2110506746 hasConcept C192562407 @default.
• W2110506746 hasConcept C193867417 @default.
• W2110506746 hasConcept C204530211 @default.
• W2110506746 hasConcept C2779227376 @default.
• W2110506746 hasConcept C30239060 @default.
• W2110506746 hasConcept C41008148 @default.
• W2110506746 hasConcept C4661277 @default.
• W2110506746 hasConcept C47463417 @default.
• W2110506746 hasConcept C49040817 @default.
• W2110506746 hasConcept C530198007 @default.
• W2110506746 hasConcept C58097730 @default.
• W2110506746 hasConcept C66938386 @default.
• W2110506746 hasConcept C68928338 @default.
• W2110506746 hasConcept C69567186 @default.
• W2110506746 hasConcept C77928131 @default.
• W2110506746 hasConcept C79072407 @default.
• W2110506746 hasConcept C86803240 @default.
• W2110506746 hasConcept C97355855 @default.
• W2110506746 hasConceptScore W2110506746C121332964 @default.
• W2110506746 hasConceptScore W2110506746C127413603 @default.
• W2110506746 hasConceptScore W2110506746C135628077 @default.
• W2110506746 hasConceptScore W2110506746C137693562 @default.
• W2110506746 hasConceptScore W2110506746C151730666 @default.
• W2110506746 hasConceptScore W2110506746C154945302 @default.
• W2110506746 hasConceptScore W2110506746C159985019 @default.
• W2110506746 hasConceptScore W2110506746C177564732 @default.
• W2110506746 hasConceptScore W2110506746C186260285 @default.
• W2110506746 hasConceptScore W2110506746C192562407 @default.
• W2110506746 hasConceptScore W2110506746C193867417 @default.
• W2110506746 hasConceptScore W2110506746C204530211 @default.
• W2110506746 hasConceptScore W2110506746C2779227376 @default.
• W2110506746 hasConceptScore W2110506746C30239060 @default.
• W2110506746 hasConceptScore W2110506746C41008148 @default.
• W2110506746 hasConceptScore W2110506746C4661277 @default.
• W2110506746 hasConceptScore W2110506746C47463417 @default.
• W2110506746 hasConceptScore W2110506746C49040817 @default.
• W2110506746 hasConceptScore W2110506746C530198007 @default.
• W2110506746 hasConceptScore W2110506746C58097730 @default.
• W2110506746 hasConceptScore W2110506746C66938386 @default.
• W2110506746 hasConceptScore W2110506746C68928338 @default.
• W2110506746 hasConceptScore W2110506746C69567186 @default.
• W2110506746 hasConceptScore W2110506746C77928131 @default.
• W2110506746 hasConceptScore W2110506746C79072407 @default.
• W2110506746 hasConceptScore W2110506746C86803240 @default.
• W2110506746 hasConceptScore W2110506746C97355855 @default.
• W2110506746 hasLocation W21105067461 @default.
• W2110506746 hasOpenAccess W2110506746 @default.
• W2110506746 hasPrimaryLocation W21105067461 @default.
• W2110506746 hasRelatedWork W1494493875 @default.
• W2110506746 hasRelatedWork W1974866317 @default.
• W2110506746 hasRelatedWork W1994735784 @default.
• W2110506746 hasRelatedWork W2020450241 @default.
• W2110506746 hasRelatedWork W2096065625 @default.
• W2110506746 hasRelatedWork W2110506746 @default.
• W2110506746 hasRelatedWork W2127484724 @default.
• W2110506746 hasRelatedWork W2154010129 @default.
• W2110506746 hasRelatedWork W280118742 @default.
• W2110506746 hasRelatedWork W3208842067 @default.

• next