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• W2110507908 abstract "This paper presents a silicon-micromachined microstrip antenna in which both feeding power and ground interconnection are performed along the vertical direction of the substrate at the wafer level. The antenna has a stacked structure consisting of a patch antenna substrate and a feed substrate. The structure possesses the following novel points: (i) it satisfies both optimum design and ease of wafer handling in the fabrication process; (ii) the ground plane intervened in the microstrip antenna is interconnected by through-wafer vias. The measured radiation patterns of the developed antenna at an 80-GHz band showed good agreement with the designed patterns. This newly developed technology can be utilized for wafer-level stacking to achieve a compact array antenna in the millimeterwave range." @default.
• W2110507908 created "2016-06-24" @default.
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• W2110507908 date "2006-05-25" @default.
• W2110507908 modified "2023-09-28" @default.
• W2110507908 title "A Millimeterwave Microstrip Antenna with Micromachined Wafer-Level Stacking Structure" @default.
• W2110507908 cites W2097077443 @default.
• W2110507908 cites W2164247957 @default.
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• W2110507908 doi "https://doi.org/10.1109/memsys.2006.1627939" @default.
• W2110507908 hasPublicationYear "2006" @default.
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