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- W2111657235 abstract "Epoxy composites filled with negative thermal expansion nanoparticles, Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N, modified by a plasma treatment were prepared. Thermal expansion properties and thermal conductivities of the Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N/ epoxy composites were investigated within the temperature range of 77—300 K. Compared to neat epoxy resin, Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N/epoxy composites show remarkably lower coefficient of thermal expansions (CTEs) and higher thermal conductivities. Especially for the composite with 32 vol.% of Mn 3 (Cu 0.6 Si 0.15 Ge 0.25 )N, the reduction of CTE value up to 42% in the temperature range of 77—195 K, and the thermal conductivities are 2.8 and 4 times as large as those of the neat epoxy resin at 298 and 77 K, respectively." @default.
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- W2111657235 date "2010-10-27" @default.
- W2111657235 modified "2023-10-10" @default.
- W2111657235 title "Preparation and thermal properties of epoxy composites filled with negative thermal expansion nanoparticles modified by a plasma treatment" @default.
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- W2111657235 doi "https://doi.org/10.1177/0021998310385031" @default.
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