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- W2111714150 abstract "A homogeneous melting eutectic Au/Sn solder bump for laser chip application has been developed. The under-bump metallization consists of a Ni wetting layer, a plating seed layer of Pt/Au/Ti multi-layer scheme. The solder is electroplated as a sequence of Ni, Au and Sn layers. The bump can be exposed to multi-step reflow cycles. The reflow of the solder as plated starts with a phase forming process in the solid state which results in an eutectic-like phase and the near eutectic dand z phases. The dand z phases dissolve during the liquid state stage of the reflow at temperatures between 300 and 350 °C. (© 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim)" @default.
- W2111714150 created "2016-06-24" @default.
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- W2111714150 date "2006-02-01" @default.
- W2111714150 modified "2023-09-25" @default.
- W2111714150 title "A new approach of creating Au-Sn solder bumps from electroplating" @default.
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- W2111714150 doi "https://doi.org/10.1002/crat.200510547" @default.
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