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• W2112376239 abstract "Chip-on-flex power overlay technology, the advanced power electronic packaging technology developed at GE CRD, eliminates the need for wire bonds, offers low inductance strip-lined power electrodes, and low parasitic impedance. In addition, the planarity of the top layer structure and the thermal base provide double-sided cooling capability and improve the size, weight, cost, and thermal and electrical performance of the package." @default.
• W2112376239 created "2016-06-24" @default.
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• W2112376239 date "2002-11-08" @default.
• W2112376239 modified "2023-09-27" @default.
• W2112376239 title "An advanced approach to power module packaging" @default.
• W2112376239 doi "https://doi.org/10.1109/iwipp.2000.885167" @default.
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