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- W2114098152 abstract "Higher yield loss caused by Ml-bridge was found in sub 130nm logic products with multi-level copper interconnect. With the help of FIB, SEM and EDX, the organic surface particle induced during W CT-CMP was considered to result in the Ml-bridge, and then the mechanism of the Ml-bridge was analyzed. Through partition check on post CMP cleaner to reduce the organic particle contamination, it was found that Brush 2 with HF spraying and closed mechanical scrubbing directly induced the organic surface particles, so the Brush 2 was optimized to be open. In addition, combined to optimizing on Mega tank and Brush 1, the defect count was effectively reduced for W CT-CMP, and thus the yield on 130nm logic products were verified to be improved greatly" @default.
- W2114098152 created "2016-06-24" @default.
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- W2114098152 date "2006-01-01" @default.
- W2114098152 modified "2023-09-26" @default.
- W2114098152 title "Optimizing post cleaning of Tungsten contact CMP to improve the yield of logic products with copper interconnect" @default.
- W2114098152 cites W1978327768 @default.
- W2114098152 doi "https://doi.org/10.1109/icsict.2006.306249" @default.
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