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- W2114360676 abstract "In this paper we investigate the electrical properties of hydrophobic silicon wafer bonded interface. Platinum diffusion, commonly used to enhance fast bipolar P-i-N diodes, is performed to control its electrical properties. The control of the bonded interface properties is a necessary condition to integrate the wafer bonding technique as a new manufacturing process for structures such as bidirectional switch devices. This work is based on spreading Resistance (SR), Deep Level Transient Spectroscopy (DLTS) and Micro-PhotoConductivity Decay (μ-PCD) characterizations of as-bonded and platinum decorated silicon direct wafer bonded interfaces." @default.
- W2114360676 created "2016-06-24" @default.
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- W2114360676 date "2010-01-01" @default.
- W2114360676 modified "2023-09-27" @default.
- W2114360676 title "Platinum decoration of silicon direct wafer bonded interfaces" @default.
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- W2114360676 doi "https://doi.org/10.1109/miel.2010.5490487" @default.
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