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- W2114373186 abstract "A discussion of three different methods of monitoring CMP process parameters are presented that can help lead to improved manufacturing productivity. The three methods include data capture of down force from load cell output, direct pressure uniformity measurements from wafer carrier surfaces and wafer shape measurements of pre-polished wafers." @default.
- W2114373186 created "2016-06-24" @default.
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- W2114373186 date "2002-11-23" @default.
- W2114373186 modified "2023-09-25" @default.
- W2114373186 title "Monitoring key CMP process parameters to improve manufacturing productivity" @default.
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- W2114373186 doi "https://doi.org/10.1109/issm.1997.664636" @default.
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