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- W2115055444 abstract "Micro-structure of a electroless Au/Ni bump on AI elcctrode has been studied to clarify a degradation mechanism of sticking ability betwecn A1 and Ni which directly causes an increase of a contact resistance at the electrode in ULSI. We have clarified that the Ni film formed by the electroless plating is an amorphous or amorphous like micro-crystal and the Ni near the AuiNi interface seems to have a lamella structure. Also, a highly oriented crystal Au exists in a grain boundaries among the electroless Ni film. In addition, we have demonstrated the presence of an amorphous phase between the Ni and the A1 electrode interface for the first time. These results explain the reason of the degradation of sticking ability between the AI electrode and the electroless Ni film." @default.
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- W2115055444 date "1997-04-16" @default.
- W2115055444 modified "2023-09-28" @default.
- W2115055444 title "TEM Study Of Electrode Structure Formed By Electroless Plating" @default.
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