Matches in SemOpenAlex for { <https://semopenalex.org/work/W2116610040> ?p ?o ?g. }
Showing items 1 to 90 of
90
with 100 items per page.
- W2116610040 abstract "Wire-bonding is and will stay one of the essential interconnection methods in electronic packaging. Physics-based modeling of interconnects between the wire material and the substrate metallization has been constantly advanced over the last five years. Due to the variety and complexity of the mechanisms occurring during bonding it is required to clarify some open issues for a thorough interpretation of the metallurgical processes that take place at the interface of the weld and in the wire. One of these issues relates to the thermo-mechanical processes at or in the vicinity in the interface between the wire and the substrate during an ultrasonic wedge/wedge wire-bonding. These processes shall be qualified by a micro-thermomechanical model and also incorporated quantitatively in the bonding process. In this paper a thermomechanical analysis of ultrasonic wire bonding is performed by means of 3D finite element (FE) simulations. On the wire the bonding force is applied as well as ultrasonic vibration, which causes shear stresses in the wire and a frictional movement between the wire and the pad. The change of temperature in the interface between the aluminum wire and the gold metallization of a copper-nickel pad is studied. It is shown that a rise of temperature is obtained due to the plastic deformation of the wire caused by the bonding force, the shear stresses and by the friction with the pad. It is also shown that the maximum temperature is still lower than the temperature required for a proper material transport, proofing that this temperature rise cannot be alone responsible for ultrasonic wire bonding." @default.
- W2116610040 created "2016-06-24" @default.
- W2116610040 creator A5005200857 @default.
- W2116610040 creator A5060895912 @default.
- W2116610040 creator A5062564374 @default.
- W2116610040 creator A5062622678 @default.
- W2116610040 date "2010-12-01" @default.
- W2116610040 modified "2023-10-03" @default.
- W2116610040 title "Thermomechanical description of interface formation in aluminum ultrasound (US)-wedge/wedge-wirebond contacts" @default.
- W2116610040 cites W2418239250 @default.
- W2116610040 cites W2468441793 @default.
- W2116610040 doi "https://doi.org/10.1109/eptc.2010.5702686" @default.
- W2116610040 hasPublicationYear "2010" @default.
- W2116610040 type Work @default.
- W2116610040 sameAs 2116610040 @default.
- W2116610040 citedByCount "0" @default.
- W2116610040 crossrefType "proceedings-article" @default.
- W2116610040 hasAuthorship W2116610040A5005200857 @default.
- W2116610040 hasAuthorship W2116610040A5060895912 @default.
- W2116610040 hasAuthorship W2116610040A5062564374 @default.
- W2116610040 hasAuthorship W2116610040A5062622678 @default.
- W2116610040 hasConcept C119599485 @default.
- W2116610040 hasConcept C120665830 @default.
- W2116610040 hasConcept C121332964 @default.
- W2116610040 hasConcept C123745756 @default.
- W2116610040 hasConcept C127413603 @default.
- W2116610040 hasConcept C135628077 @default.
- W2116610040 hasConcept C140269135 @default.
- W2116610040 hasConcept C159985019 @default.
- W2116610040 hasConcept C165005293 @default.
- W2116610040 hasConcept C186260285 @default.
- W2116610040 hasConcept C191897082 @default.
- W2116610040 hasConcept C192562407 @default.
- W2116610040 hasConcept C19474535 @default.
- W2116610040 hasConcept C31258907 @default.
- W2116610040 hasConcept C41008148 @default.
- W2116610040 hasConcept C47422493 @default.
- W2116610040 hasConcept C49040817 @default.
- W2116610040 hasConcept C513153333 @default.
- W2116610040 hasConcept C530198007 @default.
- W2116610040 hasConcept C66938386 @default.
- W2116610040 hasConcept C96035792 @default.
- W2116610040 hasConceptScore W2116610040C119599485 @default.
- W2116610040 hasConceptScore W2116610040C120665830 @default.
- W2116610040 hasConceptScore W2116610040C121332964 @default.
- W2116610040 hasConceptScore W2116610040C123745756 @default.
- W2116610040 hasConceptScore W2116610040C127413603 @default.
- W2116610040 hasConceptScore W2116610040C135628077 @default.
- W2116610040 hasConceptScore W2116610040C140269135 @default.
- W2116610040 hasConceptScore W2116610040C159985019 @default.
- W2116610040 hasConceptScore W2116610040C165005293 @default.
- W2116610040 hasConceptScore W2116610040C186260285 @default.
- W2116610040 hasConceptScore W2116610040C191897082 @default.
- W2116610040 hasConceptScore W2116610040C192562407 @default.
- W2116610040 hasConceptScore W2116610040C19474535 @default.
- W2116610040 hasConceptScore W2116610040C31258907 @default.
- W2116610040 hasConceptScore W2116610040C41008148 @default.
- W2116610040 hasConceptScore W2116610040C47422493 @default.
- W2116610040 hasConceptScore W2116610040C49040817 @default.
- W2116610040 hasConceptScore W2116610040C513153333 @default.
- W2116610040 hasConceptScore W2116610040C530198007 @default.
- W2116610040 hasConceptScore W2116610040C66938386 @default.
- W2116610040 hasConceptScore W2116610040C96035792 @default.
- W2116610040 hasLocation W21166100401 @default.
- W2116610040 hasOpenAccess W2116610040 @default.
- W2116610040 hasPrimaryLocation W21166100401 @default.
- W2116610040 hasRelatedWork W1571906921 @default.
- W2116610040 hasRelatedWork W1605200756 @default.
- W2116610040 hasRelatedWork W1920628420 @default.
- W2116610040 hasRelatedWork W1964961111 @default.
- W2116610040 hasRelatedWork W1965825415 @default.
- W2116610040 hasRelatedWork W1972819627 @default.
- W2116610040 hasRelatedWork W2006067347 @default.
- W2116610040 hasRelatedWork W2036433688 @default.
- W2116610040 hasRelatedWork W2146704822 @default.
- W2116610040 hasRelatedWork W2165391385 @default.
- W2116610040 hasRelatedWork W2291662449 @default.
- W2116610040 hasRelatedWork W2362072471 @default.
- W2116610040 hasRelatedWork W2368822701 @default.
- W2116610040 hasRelatedWork W2389231866 @default.
- W2116610040 hasRelatedWork W2462585356 @default.
- W2116610040 hasRelatedWork W2527723055 @default.
- W2116610040 hasRelatedWork W2557022147 @default.
- W2116610040 hasRelatedWork W2790741358 @default.
- W2116610040 hasRelatedWork W2935895386 @default.
- W2116610040 hasRelatedWork W637724741 @default.
- W2116610040 isParatext "false" @default.
- W2116610040 isRetracted "false" @default.
- W2116610040 magId "2116610040" @default.
- W2116610040 workType "article" @default.