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- W2116745056 abstract "Wafer level packaging methods of MEMS are described. These play important roles to reduce cost and to improve reliability. MEMS structures on silicon chips are encapsulated with bonded caps or with shells fabricated by surface micromachining, and electrical interconnections are made from the cavity. Vacuum packaging methods are also described." @default.
- W2116745056 created "2016-06-24" @default.
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- W2116745056 date "2009-06-01" @default.
- W2116745056 modified "2023-10-16" @default.
- W2116745056 title "Wafer level packaging of MEMS" @default.
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- W2116745056 doi "https://doi.org/10.1109/sensor.2009.5285574" @default.
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