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- W2116795321 abstract "Functions and definitions of electronics packaging - along with product-oriented electronics packaging and interconnection technologies, including roadmap and packaging requirements for portable electronics in the year 2000, are reviewed. It has been determined that high-density packaging is the major product driving force in today's highly competitive electronics industry. Accordingly, major trends and developments in microelectronics packaging and interconnection are presented and discussed." @default.
- W2116795321 created "2016-06-24" @default.
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- W2116795321 date "2002-11-19" @default.
- W2116795321 modified "2023-09-26" @default.
- W2116795321 title "Trends in microelectronics packaging and interconnection" @default.
- W2116795321 cites W1947687523 @default.
- W2116795321 doi "https://doi.org/10.1109/iemt.1995.540987" @default.
- W2116795321 hasPublicationYear "2002" @default.
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