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- W2116875649 abstract "The electromigration of flip chip solder joints is an ongoing reliability concern for manufacturers of integrated circuit (IC) components and electronic systems. As power levels of ICs continue to increase, current densities within individual solder bumps often increase, along with the operation temperatures of the die surface. Both of these factors have detrimental impact on the electromigration (EM) performance of the solder bumps, as they provide increased driving forces for the diffusion and dissolution of the under bump metallization (UBM) into the solder bumps. Additionally, these changes are occurring concurrently with the transition to Pb-free solder bumps for the next technology node. Compared to commonly used high-Pb bumps, Pb-free bumps typically have reduced lifetime with similar under bump metallization. In this study, a specially designed test vehicle was used to assess the EM performance of Pb-free solder bumps. Electroplated Sn2.6Ag solder bumps were tested with a variety of current density and temperature combinations. Lifetime data were collected for each of the conditions and a prediction model is established using Black's equation. The results were also compared with previous work done on high-Pb and eutectic SnPb bumps using the same test vehicle. From this work, Pb-free solder bumps are shown to have slightly decreased lifetime compared to high-Pb bumps, but still significantly higher than eutectic SnPb solder bumps. With the correct design strategies, including optimized via opening sizes and under bump metallization materials, SnAg Pb-free bumps can provide sufficient reliability for a majority of application conditions." @default.
- W2116875649 created "2016-06-24" @default.
- W2116875649 creator A5008627596 @default.
- W2116875649 creator A5013073317 @default.
- W2116875649 creator A5022735282 @default.
- W2116875649 creator A5027475930 @default.
- W2116875649 creator A5031421513 @default.
- W2116875649 date "2009-05-01" @default.
- W2116875649 modified "2023-09-25" @default.
- W2116875649 title "A comparison study of electromigration performance of Pb-free flip chip solder bumps" @default.
- W2116875649 cites W1999109929 @default.
- W2116875649 cites W2030515449 @default.
- W2116875649 cites W2118027004 @default.
- W2116875649 cites W2140533554 @default.
- W2116875649 cites W2143327466 @default.
- W2116875649 doi "https://doi.org/10.1109/ectc.2009.5074120" @default.
- W2116875649 hasPublicationYear "2009" @default.
- W2116875649 type Work @default.
- W2116875649 sameAs 2116875649 @default.
- W2116875649 citedByCount "4" @default.
- W2116875649 countsByYear W21168756492012 @default.
- W2116875649 countsByYear W21168756492015 @default.
- W2116875649 countsByYear W21168756492017 @default.
- W2116875649 crossrefType "proceedings-article" @default.
- W2116875649 hasAuthorship W2116875649A5008627596 @default.
- W2116875649 hasAuthorship W2116875649A5013073317 @default.
- W2116875649 hasAuthorship W2116875649A5022735282 @default.
- W2116875649 hasAuthorship W2116875649A5027475930 @default.
- W2116875649 hasAuthorship W2116875649A5031421513 @default.
- W2116875649 hasConcept C115900370 @default.
- W2116875649 hasConcept C119599485 @default.
- W2116875649 hasConcept C121332964 @default.
- W2116875649 hasConcept C123745756 @default.
- W2116875649 hasConcept C125619702 @default.
- W2116875649 hasConcept C127413603 @default.
- W2116875649 hasConcept C138055206 @default.
- W2116875649 hasConcept C148043351 @default.
- W2116875649 hasConcept C159985019 @default.
- W2116875649 hasConcept C163258240 @default.
- W2116875649 hasConcept C18168003 @default.
- W2116875649 hasConcept C191897082 @default.
- W2116875649 hasConcept C192562407 @default.
- W2116875649 hasConcept C207740977 @default.
- W2116875649 hasConcept C2779227376 @default.
- W2116875649 hasConcept C31258907 @default.
- W2116875649 hasConcept C41008148 @default.
- W2116875649 hasConcept C43214815 @default.
- W2116875649 hasConcept C50296614 @default.
- W2116875649 hasConcept C51807945 @default.
- W2116875649 hasConcept C62520636 @default.
- W2116875649 hasConcept C68928338 @default.
- W2116875649 hasConcept C79072407 @default.
- W2116875649 hasConcept C87976508 @default.
- W2116875649 hasConcept C94709252 @default.
- W2116875649 hasConcept C97850793 @default.
- W2116875649 hasConceptScore W2116875649C115900370 @default.
- W2116875649 hasConceptScore W2116875649C119599485 @default.
- W2116875649 hasConceptScore W2116875649C121332964 @default.
- W2116875649 hasConceptScore W2116875649C123745756 @default.
- W2116875649 hasConceptScore W2116875649C125619702 @default.
- W2116875649 hasConceptScore W2116875649C127413603 @default.
- W2116875649 hasConceptScore W2116875649C138055206 @default.
- W2116875649 hasConceptScore W2116875649C148043351 @default.
- W2116875649 hasConceptScore W2116875649C159985019 @default.
- W2116875649 hasConceptScore W2116875649C163258240 @default.
- W2116875649 hasConceptScore W2116875649C18168003 @default.
- W2116875649 hasConceptScore W2116875649C191897082 @default.
- W2116875649 hasConceptScore W2116875649C192562407 @default.
- W2116875649 hasConceptScore W2116875649C207740977 @default.
- W2116875649 hasConceptScore W2116875649C2779227376 @default.
- W2116875649 hasConceptScore W2116875649C31258907 @default.
- W2116875649 hasConceptScore W2116875649C41008148 @default.
- W2116875649 hasConceptScore W2116875649C43214815 @default.
- W2116875649 hasConceptScore W2116875649C50296614 @default.
- W2116875649 hasConceptScore W2116875649C51807945 @default.
- W2116875649 hasConceptScore W2116875649C62520636 @default.
- W2116875649 hasConceptScore W2116875649C68928338 @default.
- W2116875649 hasConceptScore W2116875649C79072407 @default.
- W2116875649 hasConceptScore W2116875649C87976508 @default.
- W2116875649 hasConceptScore W2116875649C94709252 @default.
- W2116875649 hasConceptScore W2116875649C97850793 @default.
- W2116875649 hasLocation W21168756491 @default.
- W2116875649 hasOpenAccess W2116875649 @default.
- W2116875649 hasPrimaryLocation W21168756491 @default.
- W2116875649 hasRelatedWork W1899561065 @default.
- W2116875649 hasRelatedWork W1943365142 @default.
- W2116875649 hasRelatedWork W2007536553 @default.
- W2116875649 hasRelatedWork W2059279937 @default.
- W2116875649 hasRelatedWork W2068951465 @default.
- W2116875649 hasRelatedWork W2099750509 @default.
- W2116875649 hasRelatedWork W2115956079 @default.
- W2116875649 hasRelatedWork W2116875649 @default.
- W2116875649 hasRelatedWork W2128743161 @default.
- W2116875649 hasRelatedWork W2262563805 @default.
- W2116875649 isParatext "false" @default.
- W2116875649 isRetracted "false" @default.
- W2116875649 magId "2116875649" @default.
- W2116875649 workType "article" @default.