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- W2116892153 abstract "Recently, wafer level package (WLP) has become one of the promising packaging technologies due to its advantages such as fewer processing steps, lower cost, and enhanced device performance compared to single chip packages. Many developments on new WLP design, material and process have been accomplished according to the electrical, mechanical performance and reliability requirement of the devices to be packaged. For the lower cost, higher performance and environmentally green packaging process, anisotropic conductive films (ACFs) flip chip assembly has been widely used such as ultra-fine pitch flat panel display (FPD) and general semiconductor packaging applications. However, there has been no previous attempt using on WLP. In this study, wafer level packages using pre-applied ACFs on a wafer for flip-chip interconnections have been investigated, and the effect of process parameters on the ACF wafer level package performance were investigated. After ACF lamination on an Au stud bumped wafer, and subsequent singulation, and singulated chips were flip-chip assembled on an organic substrate using a thermo-compression bonding method. Au stud bumps were well assembled on Ni/Au pads of organic substrates. And ACF joints between Au stud bumps and substrate pads showed stable bump contact resistance of 8/spl sim/9m/spl Omega/ per a bump. As a summary, new wafer level package method using pre-applied anisotropic conductive films was successively demonstrated for flip chip interconnections. As a result, the newly developed WLP using pre-applied ACFs can be widely used for many non-solder flip chip assembly applications." @default.
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- W2116892153 date "2006-07-10" @default.
- W2116892153 modified "2023-09-25" @default.
- W2116892153 title "Wafer-Level Package using Pre-Applied Anisotropic Conductive Films (ACFs) for Flip-Chip Interconnections" @default.
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- W2116892153 doi "https://doi.org/10.1109/ectc.2006.1645705" @default.
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