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- W2117305598 abstract "The processes of fabricating the etch mask for a glass dry etching are complicated and require high cost. To reduce these disadvantages, we suggest a novel glass dry etching method using a single photoresist mask. In this work, we figured out the optimized condition for the glass dry etching using a photoresist without any metal or silicon mask. We observed the characteristics of quartz wafer, such as the etch profile, etch rate, the selectivity and the critical dimension loss rate." @default.
- W2117305598 created "2016-06-24" @default.
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- W2117305598 date "2011-02-01" @default.
- W2117305598 modified "2023-10-18" @default.
- W2117305598 title "The characteristics of glass deep dry etching process with a single PR mask" @default.
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- W2117305598 doi "https://doi.org/10.1109/nems.2011.6017495" @default.
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