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- W2117884744 abstract "Two methods to form nanoparticles at a certain depth in a thin oxide layer by negative-ion implantation into the oxide layer of silicon substrate have been investigated. One method is by implantation at a low energy and the other is by a thermal diffusion after implantation. Regarding the low-energy implantation, about 1keV of ion energy is required. In general, a surface charge-up of the oxide layer arises from a positive-ion implantation to affect ion penetration depth. In this research, we used negative ion implantation because of its advantage of almost “charge-up-free” feature, even for insulating materials. We obtained delta-layered gold nanoparticles (Au NPs) in a 25nm thick SiO2 layer on Si by the low-energy implantation method of gold negative ions at 1keV. The center depth and an average diameter of the delta-layered Au NPs were 5nm and 7nm, respectively. As by the thermal diffusion after implantation, silver negative ions were implanted into 25nm thick SiO2∕Si at 10keV with 5×1015ions∕cm2 at room temperature. Implanted atoms diffused from the implanted site, depending on annealing temperature. Only after annealing at 700°C, delta-layered silver nanoparticles (Ag NPs) were obtained near the interface of SiO2∕Si." @default.
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- W2117884744 date "2006-03-01" @default.
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- W2117884744 title "Negative-ion implantation into thin SiO2 layer for defined nanoparticle formation" @default.
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- W2117884744 doi "https://doi.org/10.1063/1.2163287" @default.
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