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- W2118052653 abstract "Wideband vertical interconnects are needed for high density packaging of 3-dimensional designs in electronic and optoelectronic applications. A DC-50 GHz through-wafer transmission line based on a coplanar waveguide configuration is presented. Wideband operation is achieved by printing a CPW on the sidewall of a wet etched cavity. Simulated and measured results are given for several vertical interconnects. The best design exhibits a 0.1 dB loss per vertical interconnect at 40 GHz and a return loss greater than 19 dB from 0.45-50 GHz." @default.
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- W2118052653 date "2004-11-08" @default.
- W2118052653 modified "2023-09-26" @default.
- W2118052653 title "Ultra-wideband silicon through-wafer transmission lines" @default.
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- W2118052653 doi "https://doi.org/10.1109/mwsym.2004.1336019" @default.
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