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• W2118120108 abstract "High voltage thyristors have been fabricated by direct wafer bonding. Thyristors were fabricated by joining anode and cathode wafers nominally designed for 6 kV operation. Wafer bonded 100 mm diameter thyristors with breakdown voltages exceeding 7 kV were successfully fabricated. Bonded transistors with forward voltage drops comparable to control devices showed lower switching loss possibly due to advantageous recombination at the bond interface. This is the first demonstration of large area bonded power devices with breakdown voltages exceeding 6 kV." @default.
• W2118120108 created "2016-06-24" @default.
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• W2118120108 date "2002-11-13" @default.
• W2118120108 modified "2023-09-27" @default.
• W2118120108 title "A 6 kV thyristor fabricated by direct wafer bonding" @default.
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• W2118120108 doi "https://doi.org/10.1109/ispsd.2001.934592" @default.
• W2118120108 hasPublicationYear "2002" @default.
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