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• W2118754508 abstract "Interface fracture properties are increasingly requested in electronic packaging, be it for design problems or reliability issues. We demonstrate an induced delamination of the epoxy molding compound and die silicon interface, and propose a mixed mode chisel testing setup (MMC) and its experimental procedure. The MMC addresses several drawbacks of existing methods. The work includes samples from package fabrication processes and the establishing of critical fracture mechanics properties through finite element simulation. The setup allows for the investigation of interfaces at package scale." @default.
• W2118754508 created "2016-06-24" @default.
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• W2118754508 date "2009-04-01" @default.
• W2118754508 modified "2023-09-26" @default.
• W2118754508 title "Induced delamination of silicon-molding compound interfaces" @default.
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• W2118754508 doi "https://doi.org/10.1109/esime.2009.4938478" @default.
• W2118754508 hasPublicationYear "2009" @default.
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