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- W2120010806 abstract "The integration level of RFICs has exhibited considerable progress during the last decade. Si-based single-chip GSM, Bluetooth and DECT transceivers have been reported, while the most exciting milestone for integration will be the RF-system-on-a-chip (i.e., RF-SoC) product for single-chip multiband multi-standard cellular ICs that support broadband communication. To achieve this highest level of RFIC integration, one has to choose a radio system architecture that requires a minimal number of external components, together with a judicious selection of the IC technology for implementation. For example, we anticipate the direct-conversion or a robust low-IF receiver architecture to become the dominant choice for 3G handset applications. We also expect the Si/SiGe BiCMOS technology to be the optimal device technology for implementing low-power cellular RF-SoC products, while RF-CMOS technology will probably be most successful for the low-cost, less performance sensitive Bluetooth and/or wireless LAN applications." @default.
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- W2120010806 date "2003-10-01" @default.
- W2120010806 modified "2023-09-26" @default.
- W2120010806 title "RF-SoC: low-power single-chip radio design using Si/SiGe BiCMOS technology" @default.
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- W2120010806 doi "https://doi.org/10.1109/icmmt.2002.1187629" @default.
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