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- W2120078686 abstract "We have demonstrated and analyzed very large arrays of flip-chip bonded InGaAs/InP photodetectors, in particular paying attention to how their series and shunt resistances affect zero-bias photocurrent and therefore yield for spectrometer applications. Our device design results in very low series resistance of the diode and high photocurrent collection efficiency at zero-bias. It was shown that for an integrated circuit array wherein attention is paid to eliminating resistance between the flip-chip bonding pad and the feedback resistor node, the effect of leaky diodes is nearly eliminated." @default.
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- W2120078686 date "1998-01-01" @default.
- W2120078686 modified "2023-09-25" @default.
- W2120078686 title "Very large arrays of flip-chip bonded 1.55-/spl mu/m photodiodes for spectroscopic monitoring of WDM networks" @default.
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- W2120078686 doi "https://doi.org/10.1109/cleo.1998.675858" @default.
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