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• W2120596005 abstract "The mechanical integrity of surface-mount technology (SMT) plastic leaded chip carrier (PLCC) solder joints has been studied by a four-point mechanical flexure fatigue test. The effects of printed circuit board (PCB) pad surface composition and testing temperature on solder-joint reliability are emphasized. Three sets of PCBs have been tested, one with Cu-Ni-Sn pad surface metallurgy, one with Cu-Ni-Au, and one with SMOBC/SSC (solder mask over bare copper selective solder coating). The solder composition was the 63 wt.%Sn/37 wt.%Pb eutectic. A two-parameter Weibull distribution was used for the lifetime model for these three products. The uniformity, quality, reliability, and a comparison of these products are discussed. The joints formed on Cu-Ni-Au and SMOBC boards were appreciably more reliable than those formed on the Cu-Ni-Sn board.< <ETX xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>></ETX>" @default.
• W2120596005 created "2016-06-24" @default.
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• W2120596005 date "1988-01-01" @default.
• W2120596005 modified "2023-09-26" @default.
• W2120596005 title "Experimental and statistical analyses of surface-mount technology PLCC solder-joint reliability" @default.
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• W2120596005 doi "https://doi.org/10.1109/24.9876" @default.
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