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- W2123543596 endingPage "541" @default.
- W2123543596 startingPage "531" @default.
- W2123543596 abstract "This paper attempts to perform thermal enhancement of planar multiple-chip modules (MCMs) containing a number of chips of equal and/or unequal power through optimal chip placement design. To achieve the goal, an effective design approach is presented for the thermal design optimization problems in the context of models of placement of chips in MCMs. The approach combines the use of the currently proposed response surface (RS) based methodology, which is an optimization algorithm and a finite element modeling technique. The proposed RS-based methodology is used for creating a macro mathematical expression of the design objective of the thermal optimization problem, i.e., the total chip junction temperature of the system, associated with the design parameters, including the chip location and power. The validity of the mathematical expressions constructed is verified through two approaches. Furthermore, to make the constructed mathematical expression more compact while maintaining the associated solution accuracy, the backward variable elimination technique is employed. The effectiveness of the proposed design optimization methodology is demonstrated through several design case studies involving planar plastic ball grid array type MCMs. It is found that the proposed RS-based methodology could accurately define the macro mathematical model of the total system chip junction temperature in terms of the chip location and power. In addition, results show that the current optimal chip placement design can provide a minimal system temperature." @default.
- W2123543596 created "2016-06-24" @default.
- W2123543596 creator A5046962657 @default.
- W2123543596 creator A5060262006 @default.
- W2123543596 creator A5064306635 @default.
- W2123543596 date "2009-09-01" @default.
- W2123543596 modified "2023-09-24" @default.
- W2123543596 title "Response Surface Based Optimization Approach for Thermal Placement Design of Chips in Multiple-Chip Modules" @default.
- W2123543596 cites W2015382466 @default.
- W2123543596 cites W2099508120 @default.
- W2123543596 cites W2106967451 @default.
- W2123543596 cites W2107182057 @default.
- W2123543596 cites W2120596022 @default.
- W2123543596 cites W2129434903 @default.
- W2123543596 cites W2168480664 @default.
- W2123543596 cites W2237440835 @default.
- W2123543596 cites W2502759836 @default.
- W2123543596 cites W2562871560 @default.
- W2123543596 doi "https://doi.org/10.1109/tcapt.2009.2022272" @default.
- W2123543596 hasPublicationYear "2009" @default.
- W2123543596 type Work @default.
- W2123543596 sameAs 2123543596 @default.
- W2123543596 citedByCount "6" @default.
- W2123543596 countsByYear W21235435962013 @default.
- W2123543596 countsByYear W21235435962019 @default.
- W2123543596 countsByYear W21235435962023 @default.
- W2123543596 crossrefType "journal-article" @default.
- W2123543596 hasAuthorship W2123543596A5046962657 @default.
- W2123543596 hasAuthorship W2123543596A5060262006 @default.
- W2123543596 hasAuthorship W2123543596A5064306635 @default.
- W2123543596 hasConcept C118021083 @default.
- W2123543596 hasConcept C119857082 @default.
- W2123543596 hasConcept C121332964 @default.
- W2123543596 hasConcept C121684516 @default.
- W2123543596 hasConcept C127413603 @default.
- W2123543596 hasConcept C134786449 @default.
- W2123543596 hasConcept C149635348 @default.
- W2123543596 hasConcept C151730666 @default.
- W2123543596 hasConcept C163258240 @default.
- W2123543596 hasConcept C165005293 @default.
- W2123543596 hasConcept C166955791 @default.
- W2123543596 hasConcept C167781694 @default.
- W2123543596 hasConcept C186394612 @default.
- W2123543596 hasConcept C199360897 @default.
- W2123543596 hasConcept C24326235 @default.
- W2123543596 hasConcept C2779343474 @default.
- W2123543596 hasConcept C41008148 @default.
- W2123543596 hasConcept C62520636 @default.
- W2123543596 hasConcept C76155785 @default.
- W2123543596 hasConcept C86803240 @default.
- W2123543596 hasConceptScore W2123543596C118021083 @default.
- W2123543596 hasConceptScore W2123543596C119857082 @default.
- W2123543596 hasConceptScore W2123543596C121332964 @default.
- W2123543596 hasConceptScore W2123543596C121684516 @default.
- W2123543596 hasConceptScore W2123543596C127413603 @default.
- W2123543596 hasConceptScore W2123543596C134786449 @default.
- W2123543596 hasConceptScore W2123543596C149635348 @default.
- W2123543596 hasConceptScore W2123543596C151730666 @default.
- W2123543596 hasConceptScore W2123543596C163258240 @default.
- W2123543596 hasConceptScore W2123543596C165005293 @default.
- W2123543596 hasConceptScore W2123543596C166955791 @default.
- W2123543596 hasConceptScore W2123543596C167781694 @default.
- W2123543596 hasConceptScore W2123543596C186394612 @default.
- W2123543596 hasConceptScore W2123543596C199360897 @default.
- W2123543596 hasConceptScore W2123543596C24326235 @default.
- W2123543596 hasConceptScore W2123543596C2779343474 @default.
- W2123543596 hasConceptScore W2123543596C41008148 @default.
- W2123543596 hasConceptScore W2123543596C62520636 @default.
- W2123543596 hasConceptScore W2123543596C76155785 @default.
- W2123543596 hasConceptScore W2123543596C86803240 @default.
- W2123543596 hasIssue "3" @default.
- W2123543596 hasLocation W21235435961 @default.
- W2123543596 hasOpenAccess W2123543596 @default.
- W2123543596 hasPrimaryLocation W21235435961 @default.
- W2123543596 hasRelatedWork W1584909421 @default.
- W2123543596 hasRelatedWork W1992283734 @default.
- W2123543596 hasRelatedWork W2048700411 @default.
- W2123543596 hasRelatedWork W2095623310 @default.
- W2123543596 hasRelatedWork W2107051148 @default.
- W2123543596 hasRelatedWork W2123543596 @default.
- W2123543596 hasRelatedWork W2385160685 @default.
- W2123543596 hasRelatedWork W2535498993 @default.
- W2123543596 hasRelatedWork W3001933403 @default.
- W2123543596 hasRelatedWork W4285357516 @default.
- W2123543596 hasVolume "32" @default.
- W2123543596 isParatext "false" @default.
- W2123543596 isRetracted "false" @default.
- W2123543596 magId "2123543596" @default.
- W2123543596 workType "article" @default.