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- W2124137178 abstract "Recent years have seen major innovations in cross-layer wireless designs. Despite demonstrating significant throughput gains, hardly any of these technologies have made it into real networks. Deploying cross-layer innovations requires adoption from Wi-Fi chip manufacturers. Yet, manufacturers hesitate to undertake major investments without a better understanding of how these designs interact with real networks and applications." @default.
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- W2124137178 date "2013-08-27" @default.
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- W2124137178 title "Bringing cross-layer MIMO to today's wireless LANs" @default.
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