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- W2124377675 abstract "M'anufacturers, suppliers. and industry consortia have all been working towards a common acceptable drop-in solution for the standard eutectic tin lead. SnAgCu alloys are now chTccted to be the leading clioicc by the electronics indust?. For instance. NEMl has recommended Sn3.9AgO.6Cu as an industry standard for lead-free solder paste. with Sn0.7Cu for wave soldering. Similark, SnAgCu alloys were also recornmended for my packages. Unfortunaiely, there his been no recommendation for a lead-free finish for leaded packages: although these p:ick;iges still constitute the largest portion of the worldwide semiconductor production. The IC suppliers had to struggle to evaluate the various lead-free finish options available (e.g., NiPd. SnBi. SnCu. SnAg. and inatte Sn), and assess the resulting impact of the transition on their manufacturing logistics. Benchmarking indicated that two finishes have emerged to be leading contenders from such evaluation. namely: matte Sn and NiPd (1J). For a company to transition from tin lead to lead-free imolves resolving a number of technical and logistics issues. This has been documented earlier for National Semiconductor (3). Tlus paper will report on the solder joint reliability of matte Sn used as a finish for leaded packages. Package selection. PCB design. solder wettability? selection of reflow profiles: and effect of reflow temperature will also be discussed." @default.
- W2124377675 created "2016-06-24" @default.
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- W2124377675 date "2004-06-22" @default.
- W2124377675 modified "2023-09-25" @default.
- W2124377675 title "Board level reliability of components with matte tin lead finish" @default.
- W2124377675 cites W2151549076 @default.
- W2124377675 doi "https://doi.org/10.1109/ectc.2003.1216300" @default.
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