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- W2125364179 endingPage "222" @default.
- W2125364179 startingPage "219" @default.
- W2125364179 abstract "Hybrid microcircuits in geothermal instrumentation must operate from room temperature to 300°C. Bond failure occurred during operation of initial geothermal circuits due to intermetallic growth at the aluminum wire-to-gold conductor interface. To remedy this problem, two wire bonding techniques have been qualified in high-temperature aging tests: 1) ultrasonic bonding of aluminum wire directly to modified fritless gold conductor inks (DuPont 9910, AVX 3520, and TFS A328) and 2) insertion of a I mil diffusion barrier pad between the thick film and the aluminum wire. Both systems allow 100-1000 h operation at 300°C. Three alloys of wire were tested: pure aluminum, aluminum with I percent silicon, and aluminum with 1 percent magnesium. The degradation rates differed greatly with pure aluminum being the least tolerant to temperature aging and wire with 1 percent silicon faring best. Because thick-film surfaces tend to be harder than thin-film surfaces, hardened aluminum wire (elongation 0.5 percent) formed bonds with less pad deformation and, consequently, with higher pull strengths than standard bonding wire (elongation 1-3 percent). Comparison of wire bonds aged at three temperatures (250, 300, and 350°C) demonstrated several orders of magnitude spread in degradation rates; for 1000-h bond lifetime, 300°C was found to be about the highest allowed operational temperature for direct bonding to gold. Disks of kovar and nickel of l-mil thickness and 30 mils diam were used as diffusion barriers between the gold and aluminum. Evaporated on one side of each disk was a 1 µm gold thin film for thermocompression bonding to the thick film; the other side received an evaporated aluminum film for wire bonding. Aging for 1000 h up to 350°C produced no increase in bond resistance for any of the three wire alloys tested. Some decrease in pull strength with time was noticed but was attributed to annealing of the wire." @default.
- W2125364179 created "2016-06-24" @default.
- W2125364179 creator A5016900801 @default.
- W2125364179 creator A5078412651 @default.
- W2125364179 date "1978-09-01" @default.
- W2125364179 modified "2023-09-23" @default.
- W2125364179 title "Aluminum Wire to Thick-Film Connections for High-Temperature Operation" @default.
- W2125364179 cites W2037223466 @default.
- W2125364179 cites W2157958105 @default.
- W2125364179 cites W3047718260 @default.
- W2125364179 doi "https://doi.org/10.1109/tchmt.1978.1135292" @default.
- W2125364179 hasPublicationYear "1978" @default.
- W2125364179 type Work @default.
- W2125364179 sameAs 2125364179 @default.
- W2125364179 citedByCount "7" @default.
- W2125364179 countsByYear W21253641792018 @default.
- W2125364179 crossrefType "journal-article" @default.
- W2125364179 hasAuthorship W2125364179A5016900801 @default.
- W2125364179 hasAuthorship W2125364179A5078412651 @default.
- W2125364179 hasConcept C119599485 @default.
- W2125364179 hasConcept C127413603 @default.
- W2125364179 hasConcept C140269135 @default.
- W2125364179 hasConcept C159985019 @default.
- W2125364179 hasConcept C165005293 @default.
- W2125364179 hasConcept C191897082 @default.
- W2125364179 hasConcept C192562407 @default.
- W2125364179 hasConcept C27501479 @default.
- W2125364179 hasConcept C2780026712 @default.
- W2125364179 hasConcept C513153333 @default.
- W2125364179 hasConcept C544956773 @default.
- W2125364179 hasConceptScore W2125364179C119599485 @default.
- W2125364179 hasConceptScore W2125364179C127413603 @default.
- W2125364179 hasConceptScore W2125364179C140269135 @default.
- W2125364179 hasConceptScore W2125364179C159985019 @default.
- W2125364179 hasConceptScore W2125364179C165005293 @default.
- W2125364179 hasConceptScore W2125364179C191897082 @default.
- W2125364179 hasConceptScore W2125364179C192562407 @default.
- W2125364179 hasConceptScore W2125364179C27501479 @default.
- W2125364179 hasConceptScore W2125364179C2780026712 @default.
- W2125364179 hasConceptScore W2125364179C513153333 @default.
- W2125364179 hasConceptScore W2125364179C544956773 @default.
- W2125364179 hasIssue "3" @default.
- W2125364179 hasLocation W21253641791 @default.
- W2125364179 hasOpenAccess W2125364179 @default.
- W2125364179 hasPrimaryLocation W21253641791 @default.
- W2125364179 hasRelatedWork W1968982046 @default.
- W2125364179 hasRelatedWork W2007421459 @default.
- W2125364179 hasRelatedWork W2023478225 @default.
- W2125364179 hasRelatedWork W2060761069 @default.
- W2125364179 hasRelatedWork W2083225653 @default.
- W2125364179 hasRelatedWork W2580545854 @default.
- W2125364179 hasRelatedWork W3011519178 @default.
- W2125364179 hasRelatedWork W3144992535 @default.
- W2125364179 hasRelatedWork W4250890523 @default.
- W2125364179 hasRelatedWork W798856879 @default.
- W2125364179 hasVolume "1" @default.
- W2125364179 isParatext "false" @default.
- W2125364179 isRetracted "false" @default.
- W2125364179 magId "2125364179" @default.
- W2125364179 workType "article" @default.