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- W2125465654 abstract "This article presents a study of the issues in integrating the pattern, fill, planarization, and surface cleanup processes to design a shallow trench isolation (STI) flow suitable for 0.25 μm complementary metal–oxide semiconductor technologies. Technological choices and their effects on the characteristics of the STI technology are discussed. Experimental data are presented to illustrate how process choices at various stages of the STI flow are made to optimize the STI structure." @default.
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- W2125465654 date "1997-11-01" @default.
- W2125465654 modified "2023-09-25" @default.
- W2125465654 title "Integration of unit processes in a shallow trench isolation module for a 0.25 μm complementary metal–oxide semiconductor technology" @default.
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- W2125465654 doi "https://doi.org/10.1116/1.589581" @default.
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