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• W2126375114 abstract "A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeter wave assemblies. This paper discusses design and fabrication of such interconnects. A quasi-static model is developed to ease the quality assessment of their electrical behaviour. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibits low loss and is useable up to 50 GHz or more." @default.
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• W2126375114 date "1998-01-01" @default.
• W2126375114 modified "2023-09-24" @default.
• W2126375114 title "Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications" @default.
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• W2126375114 doi "https://doi.org/10.1109/adhes.1998.742010" @default.
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