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- W2126680329 abstract "Recent advances in temperature-compensation for FBAR (Film Bulk Acoustic Resonators) have brought this technology forward as a serious contender in the oscillator marketplace. As with any mechanical resonator oscillator, a cost-effective hermetic package combined with circuit technology are critical for commercial application. Billions of FBAR duplexers have been fabricated using Avago Technologies' wafer-scale packaging process, whereby a silicon lid wafer is Au-diffusion-bonded to a base FBAR wafer to make a robust, hermetic package. This paper presents a method for integrating circuitry into the lid wafer to form a sub-0.1 mm <sup xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>3</sup> , sub mW, 1.5 GHz temperature-compensated chip-scale oscillator. Circuit integration, testing and performance will be discussed." @default.
- W2126680329 created "2016-06-24" @default.
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- W2126680329 date "2011-05-01" @default.
- W2126680329 modified "2023-10-16" @default.
- W2126680329 title "Wafer-scale packaging for FBAR-based oscillators" @default.
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- W2126680329 doi "https://doi.org/10.1109/fcs.2011.5977848" @default.
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