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- W2126859619 abstract "We presented results of electromigration analysis by means of simulation for a complex interconnect structure produced by advanced process technology simulation tools. The analysis is based on a comprehensive vacancy dynamics model including all relevant driving forces accompanying electromigration. The chosen interconnect layout is resistant against electromigration failure for the applied operating conditions." @default.
- W2126859619 created "2016-06-24" @default.
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- W2126859619 date "2005-07-27" @default.
- W2126859619 modified "2023-09-27" @default.
- W2126859619 title "Comprehensive analysis of vacancy dynamics due to electromigration" @default.
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- W2126859619 doi "https://doi.org/10.1109/ipfa.2005.1469139" @default.
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