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- W2128587184 abstract "A highly sensitive solid-state imager has been made by connecting an avalanche multiplier film to a CMOS readout circuit via micro-bump electrodes. Optimization of the vapor-deposition conditions for the indium bump material made it possible for micro-bumps of 5 /spl mu/m diameter and 4 /spl mu/m height to be formed into a 2/3-inch matrix array of 380,000 pixels. A prototype imager was constructed with a 0.5-/spl mu/m-thick avalanche photoconductive film. Clear avalanche multiplication of about ten times was observed at an applied voltage of 75 V. The imager had a good resolution and no recognizable after-images." @default.
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- W2128587184 date "2002-11-19" @default.
- W2128587184 modified "2023-09-25" @default.
- W2128587184 title "A solid-state imager joined to an avalanche multiplier film with micro-bump electrodes" @default.
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- W2128587184 doi "https://doi.org/10.1109/iedm.1995.497208" @default.
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