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• W2129121231 abstract "The purpose of this study was to compare the effects on shear bond strength of removing excess adhesive from around the bracket base at 2 time periods: (1) immediately after placing the bracket on the tooth, and (2) after subjecting the adhesive to 5 seconds of light curing to initially secure the bracket in its proper position. The debonding forces were evaluated at 2 times; within half an hour after bonding and after storing for 24 hours in water at 37 degrees qC. These comparisons will help determine the most advantageous time for the clinician to remove excess adhesive from around the brackets during the bonding process. The teeth were randomly divided into 4 groups according to: (a) the time of removal of the excess adhesive from around the bracket base namely; immediately after placing the bracket or after 5 seconds of light cure and (b) the time of debonding the brackets, namely within half an hour or after 24 hours. Shear bond strength was measured using a Zwick test machine and calculated in Megapascals. The results of the analysis of variance (F = 35.05) comparing the 4 experimental groups indicated the presence of significant differences between all 4 groups (P = .0001). In general, the shear bond strengths were significantly larger for the 2 groups debonded after 24 hours, whether they were light cured for a total of 40 seconds (X = 8.8 +/- 3.6 MPa) or 45 seconds (X = 6.9 +/- 3.4 MPa). On the other hand, the shear bond strengths was significantly lower in the 2 groups debonded within half an hour from their initial bonding, whether light cured for 40 seconds (X = 0.4 +/- 1.0 MPa) or 45 seconds (X = 3.4 +/- 2.7 MPa). In conclusion, the additional 5 seconds of light cure significantly increased the initial shear bond strength. On the other hand, removing excess adhesive after 5 seconds of light cure significantly decreased the shear bond strength at 24 hours." @default.
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• W2129121231 date "2000-04-01" @default.
• W2129121231 modified "2023-09-23" @default.
• W2129121231 title "Comparisons of two approaches for removing excess adhesive during the bonding procedure." @default.
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• W2129121231 doi "https://doi.org/10.1043/0003-3219(2000)070<0149:cotafr>2.0.co;2" @default.
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